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2128篇 您的检索式：期刊名="Journal of Electronic Materials"

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	题名	作者	年代	出处	被引量
1	Thewettability and microstructure of Sn-Zn-RE alloys显示文摘	WuCML LawCMT YuD Q	2003	Journal of Electronic Materials2003，32，2：	3
2	Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging显示文摘	M. N. Islam Ahmed Sharif Y. C. Chan	2005	Journal of Electronic Materials2005，，2：	2
3	Fabrication of Agsheathed Bi-2223 tapes using powders produced by aerosol spray pyrolysis显示文摘	Wang Y I Bian W Zhu Y	1995	Journal of Electronic Materials1995，12，：	2
4	Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates显示文摘	Jenn-Ming Song Hsin-Yi Chuang Zong-Mou Wu	2006	Journal of Electronic Materials2006，，5：	2
5	Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment显示文摘	John N. Lalena Nancy F. Dean Martin W. Weiser	2002	Journal of Electronic Materials2002，，11：	2
6	Ultraviolet detectors based on epitaxial ZnO films grown by MOCVD显示文摘	Y. Liu C. R. Gorla S. Liang N. Emanetoglu Y. Lu H. Shen M. Wraback	2000	Journal of Electronic Materials2000，，1：	2
7	Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints 显示文摘	ChenZG ShiYW XiaZD YanYF	2002	Journal of Electronic Materials2002，31，10：	1
8	Progress in ZnO materials and devices显示文摘	LOOK D C	2006	Journal of Electronic Materials2006，35，5：	1
9	lead free ball-grid array balls: production method and properties 显示文摘	Kempf B Craft M Hutin O	2002	Journal of Electronic Materials2002，31，11：	1
10	Development of Sn-Zn lead-freesolders bearing alloying elements显示文摘	Zhang L Xue S B Gao L L	2010	Journal of Materials Sci-ence-Materials in Electronics2010，21，1：	1
11	Texture and microstructure of thin copper films显示文摘	Tracy D P Knorr D B	1993	Journal of Electronic Materials1993，22，6：	1
12	, In-process detection of microscratctling during CMP using acoustic emission sensing technology 显示文摘	Tang J Dornfeld D Pangrle S K	1998	Journal of Electronic Materials1998，27，10：	1
13	Al+ and B+ implantations into 6H-SiC epilayers and application to pn junction diodes显示文摘	T. Kimoto O. Takemura H. Matsunami T. Nakata M. Inoue	1998	Journal of Electronic Materials1998，，4：	1
14	Dielectric films for Si solar cell applications显示文摘	Bhushan Sopori	2005	Journal of Electronic Materials2005，，5：	1
15	Thermodynamic database on microsolders and copper-based alloy systems显示文摘	X. J. Liu I. Ohnuma C. P. Wang M. Jiang R. Kainuma K. Ishida M. Ode T. Koyama H. Onodera T. Suzuki	2003	Journal of Electronic Materials2003，，11：	1
16	Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements显示文摘	Jeff Sigelko S. Choi K. N. Subramanian James P. Lucas T. R. Bieler	1999	Journal of Electronic Materials1999，，11：	1
17	The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder显示文摘	Darrel Frear Dennis Grivas J. W. Morris	1987	Journal of Electronic Materials1987，，3：	1
18	The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements 显示文摘	Wu C M L Yu D Q Law C M T	2002	Journal of electronic materials2002，31，9：	1
19	Investigation of rare earth-doped BiAg high temperature solders显示文摘	SHI Y W FANG W P XIA Z D	2010	Journal of Materi- als Science: Materials in Electronics2010，21，9：	1
20	Improved mechanical properties in new Pb-free solder alloys显示文摘	Cormack M M Jin S	1994	Journal of Electron Material1994，23，7：	1

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