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18篇 您的检索式：作者名="Sigelko"

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		题名	作者	年代	出处	被引量
	1	Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements显示文摘	Jeff Sigelko S. Choi K. N. Subramanian James P. Lucas T. R. Bieler	1999	Journal of Electronic Materials1999，，11：	1
	2	Overview of lead - free selders显示文摘	Sigelko J D Subramanian K N	2000	Advanced Materials and Processes2000，157，3：	1
	3	The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints 显示文摘	SIGELKO J CHOI S SUBRANMANIAN K N LUCAS J P	2000	J Electronic Materials2000，29，：	1
	4	Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcement 显示文摘	SIGELKO J CHOI S LUCAS J P SUBRANMANIAN K N BIELER T R	1999	J Electronic Materials1999，28，：	1
	5	Overview of lead-free solders 显示文摘	Sigelko J D Subramanian K N	2000	Adv Mater Process2000，157，3：	1
	6	Overview of lead-free solders显示文摘	Sigelko J D Subramanian K N	2000	Advanced Materials and Processes2000，157，3：	1
	7	Overview of Lead - free Solder 显示文摘	Sigelko J D Subramanian K N	2000	Advanced Materials & Processes2000，，3：	1
	8	Overview of Lead-free Solders显示文摘	Sigelko J D Subrarnanian K N	2000	Advanced Materials and Processes2000，57，3：	1
	9	The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin - silver solder joints显示文摘	Sigelko J Choi S Subranmanian K N	2000	electronic materials2000，29，：	1
	10	Effect of cooling rate on micrestructure and mechanical properties of eutectic Sn - Ag soder joints with and without intertionally Iicorporated Cu6Sn5reinforcement 显示文摘	Sigelko J Choi S Lueas J P	1999	electronic materials1999，28，：	1
	11	The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints显示文摘	J. Sigelko S. Choi K. N. Subramanian J. P. Lucas	2000	Journal of Electronic Materials2000，，11：	1
	12	Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements显示文摘	Jeff Sigelko S. Choi K. N. Subramanian James P. Lucas T. R. Bieler	1999	Journal of Electronic Materials1999，，11：	1
	13	Overview of lead-free solders显示文摘	Sigelko J D Subramanian K N	2000	ADV Mater & Proc2000，157，：	1
	14	Overview of lead-free solders 显示文摘	Sigelko J D Sttbramanian K N	2000	Advanced Materials and Processes2000，157，3：	1
	15	The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints 显示文摘	Sigelko J Choi S Subranmanian K N	2000	Journal of Electronic Materials2000，，29：	1
	16	Overview of lead-free solder显示文摘	SIGELKO J D SUBRAMANIAN K N	2000	Advanced Materials and Processes2000，157，3：	1
	17	Overview of lead-free solders 显示文摘	Sigelko J D Subramanian K N	2000	Adv Mater Process2000，157，3：	1
	18	The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints显示文摘	J. Sigelko S. Choi K. N. Subramanian J. P. Lucas	2000	Journal of Electronic Materials2000，，11：	1

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