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155篇 您的检索式：作者名="Dornfeld D"

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	题名	作者	年代	出处	被引量
1	Automated energy monitoring of machine tools显示文摘	Vijayaraghavan A Dornfeld D		0，，01：	2
2	, In-process detection of microscratctling during CMP using acoustic emission sensing technology 显示文摘	Tang J Dornfeld D Pangrle S K	1998	Journal of Electronic Materials1998，27，10：	1
3	Advancing Cutting Technology 显示文摘	Byrne G Dornfeld D Denkena B	2003	Annals of the CIRP2003，52，2：	1
4	Monitoring of uhraprecision machining processes 显示文摘	Dornfeld D A Lee Y Chang A	2003	The International Journal of Advanced Manufacturing Technology2003，21，8：	1
5	An Investigation of Material Removal Mechanisms in Lapping with Grain Size Transition 显示文摘	Chang Y P Hanshimura M Dornfeld D A	2000	Journal of Manufacturing Science and Engineering2000，122，6：	1
6	Micro burr formation and minimi- zation through process control显示文摘	LEEK DORNFELD D A	2005	Precision Engineering2005，29，2：	1
7	Distress conditions during pregnancy may lead to pre- eclampsia by increasing cortisol levels and altering lymphocyte sensitivity to glucorticoids 显示文摘	Vianna P Bauer ME Dornfeld D	2011	Med Hypotheses2011，77，2：	1
8	Burr/breakout model development and experimental verification显示文摘	Chern G L Dornfeld D	1996	Journal of Engineering Materials and Technology1996，118，2：	1
9	Recent Advancesin Mechanical Micromachining显示文摘	DORNFELD D MIN S Takeuchi Y	2006	Annals of the CIRP2006，55，：	1
10	Recent advances in mechanicalmicromachining 显示文摘	Dornfeld D Min S Takeuchi Y	2006	CIRP Annals2006，55，1：	1
11	Material removal mechanism in chemical mechanical polishing: theory and modeling 显示文摘	Luo J Dornfeld D A	2001	IEE Trans Semicond Manufact2001，，14：	1
12	Material Removal Mechanism in Chemical Mechanical Polishing:Theory and Modelling显示文摘	Luo J F Dornfeld D A	2001	IEEE Transaction on Semiconductor Manufacturing2001，14，2：	1
13	Material Removal Mechanism in Chemical Mechanical Polishing:Theory and Modeling显示文摘	Luo Jianleng Dornfeld D A	2001	IEEE Transactions on Semiconductor Manufacturing2001，14，2：	1
14	Energy consumption characterization and reduction strategies for milling machine tool use显示文摘	DIAZ N REDELSHEIMER E DORNFELD D	2011	Proceedings of the 18th CIRP International Conference on Life Cycle Engineering2011，，：	1
15	An investigation of material removal mechanisms in lapping with grain size transition显示文摘	CHANG Y P HASHIMURA M DORNFELD D A	2000	Journal of Manufacturing Science and Engineering2000，122，：	1
16	Recent advances in mechanical micromachining 显示文摘	Dornfeld D Min S Takeuchi Y	2006	Annals of the CIRP2006，55，2：	1
17	Material removal mechanism in chemical mechanical polishing: theory and modeling显示文摘	LUO J F DORNFELD D A	2001	IEEE Transactions on Semiconductor Manufacturing2001，14，：	1
18	Micro-burr formation andminimization through process control 显示文摘	LEE K DORNFELD D A	2005	Precision Engi- neering2005，29，2：	1
19	An experimental study on burr formation in micro milling aluminum and copper显示文摘	Lee K Dornfeld D A	2002	Transactions of the North American Manufacturing Research Institute of SME2002，30，：	1
20	Drilling burr formation in titanium alloy Ti-6A1-4V 显示文摘	DORNFELD D A KIM J S DECHOW H	1999	CIRP An- nals- Manufacturing Technology1999，48，1：	1

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