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15篇 您的检索式：作者名="LASANCE C"

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		题名	作者	年代	出处	被引量
	1	The conceivable accuracy of experimental and numerical thermal analysis of electronic systems显示文摘	LASANCE C	2002	IEEE Trans Compon and Packag Technol2002，25，3：	1
	2	Thermal characterization of electronic devices by means of boundary condition independent compact models显示文摘	LASANCE C J M VINKE H ROSTEN H	1995	IEEE Trans on Components Packaging and manufacturing Technology1995，18，4：	1
	3	The World of Thermal Characterization according to DELPHI-Part I: Background to DELPHI 显示文摘	Rosten H I Lasance C J M Parry J D	1997	IEEE Transactions on Components Packaging and Manufacturing Technology-Part A1997，20，4：	1
	4	The World of Thermal Characterization According to DELPHI-Part II: Experimental and Numerical Methods 显示文摘	Lasance C J M Parry J D Rosten H I	1997	IEEE Transactions on Components Packaging and Manufacturing Technology-Part A1997，20，4：	1
	5	Special section on compact thermal modeling显示文摘	Lasance C	2003	IEEE Transactions on Components and Packaging Technologies2003，26，1：	1
	6	Problems with thermal interface material measurements: suggestions for improvement显示文摘	Lasance C J M	2003	Electronits Cooling2003，，11：	1
	7	Enhanced elec- tronic system reliability challenges for temperature prediction 显示文摘	Parry J D Rantala J Lasance C J M	2002	IEEE Transactions on Components and Packaging Technologies2002，25，4：	1
	8	The world of thermal characterization according to DEL-PHI-Part I: background to DELPHI 显示文摘	LASANCE C J M ROSTEN H I PARRY J D	1997	IEEE Trans Compon Pack and Manuf Tech - Part A1997，20，4：	1
	9	Enbanced electronic system reliability challenges for temperature prediction显示文摘	PARRY J D RANTALA J LASANCE C J M	2002	IEEE Transactions on Components and Packaging Technologies2002，25，4：	1
	10	The world of thermal characterization according to DELPHI-Part Ⅰ,Background to DELPHI显示文摘	Rosten H I Lasance C J M Parry J D	1997	IEEE Trans Compon Packag and Manufac Technol-Part A1997，20，4：	1
	11	The world of thermal characterization according To DELPHI-Part Ⅱ,Experimental and numerical methods显示文摘	Lasance C J M Rosten H I Parry J D	1997	IEEE Trans Compon Packag and Manufac Technol-Part A1997，20，4：	1
	12	Two benchmarks to facilitate the study of compact thermal modeling phenomena 显示文摘	LASANCE C J M	2001	IEEE Trans Compon Packg Manuf Technol2001，24，4：	1
	13	Thermal characterization of electronic devices with boundary condition independent compact models显示文摘	Lasance C J M Vinke H Rosten H I	1995	IEEE Compon Packag Manufac Technol1995，18，4：	1
	14	Temperature and relia- bility in electronics systems the missing link 显示文摘	Parry J Rantala J Lasance C	2001	Elec- tronics Cooling2001，7，4：	1
	15	Ten years of boundary-condition- independent compact thermal modeling of electronic parts- a review显示文摘	Lasance C J M	2008	Heat Transfer Engineering2008，29，2：	1

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