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| 1 | Diallyl bisphenol A-novolac epoxy system eoeured with bisphenol-A-bismaleimide-cure and thermal properties显示文摘 | AMBIKA DEVI K REGHUNADHAN NAIR C P NINAN K N | 2007 | Journal of Applied Polymer Science2007，106，2： | 1 |
| 2 | Diallylhisphenol A-novolac Epoxy System Cocured withBisphenol A-bismakimide-cure and Thermal Properties显示文摘 | Ambika Devi K Reghunadhan Nair C P Ninan K N | 2007 | Joumal of Applied Polymer Science2007，106，2： | 1 |
| 3 | Stu- dies on bismaleimide co cured Novolac epoxy diallyl bisphe aol A system,显示文摘 | Ambika Devi K Reghunadhan Nair C P Ninan K N | 2008 | Compos Interfaces2008，15，807： | 1 |
| 4 | Diallyl bisphenol A-novolac epoxy system cocured with bisphenol-A-bismaleimide-cure and thermal properties显示文摘 | AMBIKA DEVI K REGHUNADHAN NAIR C P NINAN K N | 2007 | Journal of Applied Polymer Science2007，106，2： | 1 |
| 5 | Studies on allophanate-urcthane networks based on hydroxyl terminated polybutadiene: effect of isocyanate type on the network characteristics 显示文摘 | SEKKAR V GOPALAKRISHNAN S AMBIKA DEVI K | 2003 | European Polymer Journal2003，39，： | 1 |
| 6 | Syntactic foam composites of epoxy-aHyl phenol-bismaleimide ternary blend-processing and properties 显示文摘 | Ambika Devi K John B Reghunadhan Nair C P | 2007 | Journal of Applied Polymer Science2007，105，6： | 1 |
| 7 | Diallyl blsphenol A-novolac epoxy system cocured with bisphenol- A-bismaleimide-cure and thermal properties显示文摘 | Ambika Devi K Reghunadhan Nair C P Ninan K N | 2007 | Journal of Applied Polymer Science2007，106，2： | 1 |
| 8 | Diallyl Bisphenol A-novolac Epoxy System Cocured with Bisphe-nol-A-bismaleimide-cure and Thermal Properties显示文摘 | Ambika Devi K Reghunadhan Nair CP Ninan KN | 2007 | Journal of Applied Polymer Science2007，106，： | 1 |
| 9 | Diallyl bisphenol A-novolac epoxy system cocured with bisphenol-A-bismaleimide-cure and thermal properties显示文摘 | AMBIKA DEVI K REGHUNADHAN NAIR C P NINAN K N | 2007 | Journal of Applied Polymer Science2007，106，2： | 1 |
| 10 | Alteration of structural, optical and electrical properties of CdSe incorporated polyvinyl pyrrolidone nanocomposite for memory devices显示文摘The important enhancement in the structural,dielectric and optical properties of pure polymer and CdSe incorporated polyvinyl pyrrolidone has been reported in this paper.The surface morphology of CdSe/PVP nanocomposite film is studied by using scanning electron microscopy(SEM).The chemical composition of different elements has been reported using energy dispersive X-ray(EDX)spectrum.The structure of polymer nanocomposite is determined with the help of X-ray diffraction(XRD)spectrum and is observed to be hexagonal.Particle size,intercrystalline separation,interplanner spacing,lattice parameters,strain and dislocation factors are calculated using XRD results.Fourier transform infrared spectroscopy(FTIR)and Photoluminescence(PL)analysis have been studied in order to check the possible interaction between CdSe quantum dots and polyvinyl pyrrolidone(PVP)matrix.The ac conductivity of CdSe/PVP nanocomposite is found to be higher as compared to pure polymers.The highest value of conductivity observed at 60203 Hz and at 523 K is found to be 3:72105 Sm1.Comparative study of dielectric constant,dielectric losses,dissipation factor,electric modulus and impedance has been performed.The semi-circles in impedance measurement for both materials show the bulk electrical properties that result in single relaxation process in CdSe/PVP nanocomposite. | Chetna Tyagi Ambika Devi | 2018 | Journal of Advanced Dielectrics2018，8，3： | 0 |
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