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28篇 您的检索式：期刊名="IEEE Trans Compon Packag Technol"

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	题名	作者	年代	出处	被引量
1	Errors associated with the design,calibration and application of piezoresistive stress sensors in(100)silicon 显示文摘		1994	IEEE Trans Components Packaging Manufacturing Technol1994，，：	1
2	The conceivable accuracy of experimental and numerical thermal analysis of electronic systems显示文摘	LASANCE C	2002	IEEE Trans Compon and Packag Technol2002，25，3：	1
3	Measuring partial thermal resistances in a heat-flow path 显示文摘	MARTA R SZEKELY V	2002	IEEE Trans Compon Packag Technol2002，4，25：	1
4	Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material 显示文摘	Bai J G Zhang Z Y Calata J N	2006	IEEE Trans Compon Packag Technol2006，29，3：	1
5	A constitutive model for a high lead solder显示文摘	WEN S M KEER L M VAYNMAN S	2002	IEEE Trans Compon Packag Technol2002，25，1：	1
6	Thermal con- ductivity ofmolding compounds for plastic packaging 显示文摘	BUJARD P KUHNLEIN G INO S	1994	IEEE Trans Components Packaging Manuf Technol Part A1994，17，4：	1
7	Four decades of research on thermal contact, gap, and joint resistance in microelectronics 显示文摘	YOVANOVICH M M	2005	IEEE Trans Compon Packag Technol2005，28，2：	1
8	Layer structure and thickness ef{ects on electroplated AuSn solder bump composition显示文摘	BONAFEDE S HUFFMAN A PALMER D	2006	IEEE Trans Compon and Packag Technol2006，29，3：	1
9	Nickel/palladium finish for leadframes显示文摘	ABBOTT D C	1999	IEEE Trans Compon Packag Technol1999，22，1：	1
10	Four decades of research on thermal contact, gap, andJoint resistance in microelectronics显示文摘	Yovanovich M M	2005	IEEE Trans Compon Packag Technol2005，28，2：	1
11	PCM thermal control unit for porta- ble electronic devices:experimental and numerical studies显示文摘	Alawadhi E M Amon C H	2003	IEEE Trans Compon Packag Technol2003，26，1：	1
12	A low voltage SONOS nonvolatile semiconductor memory technology 显示文摘	WHITE M YANG Y ANSHA P	1997	IEEE Trans on Compon Packag Manuf Technol1997，20，2：	1
13	Single chamber compact two-phase heat spreaders with microfabricated boiling enhancement structures显示文摘	MURTHY S S JOSHI Y K NAKAYAMA W	2002	IEEE Trans Compon Packag Technol2002，25，1：	1
14	Wafer-level Cu/Sn to Cu/Sn SLID-bonded interconnects with increased strength显示文摘	LIU He Salomonsen G WANG Kaiying	2011	IEEE Trans Compon Packaging Manuf Technol2011，1，9：	1
15	Design and performance evaluation of a compact thermosyphon显示文摘	PAL A JOSHI Y K BEITELMAL M H PATEL C D WENGER T M	2002	IEEE Trans Compon Packag Technol2002，25，4：	1
16	Integrated liquid cooling systems for 3-Dstacked TSV modules显示文摘	TANG G Y TAN S P KHAN N	2010	IEEE Trans Compon Packag Technol2010，33，1：	1
17	Reliability assessment of electronic components exposed to long-term non-operating conditions显示文摘	McCluskey F Patrick	1998	IEEE Trans Compon Packag and Manufac Technol Part A1998，21，2：	1
18	Compact 60-GHz IPD-based branch-line coupler for system-on- package V-band radios 显示文摘	HAROUN I PLETT C HSU Y C	2012	IEEE Trans Compon Packag &Manufac Technol2012，2，7：	1
19	Optical coupling methods for cost-effective polymer optical fiber communication显示文摘	CHANDRAPPAN J J ING Z MOHAN R V	2009	IEEE Trans Compon Packaging Technol2009，32，3：	1
20	Broadband and high-efficiency power amplifier that integrates CMOS and IPD technology显示文摘	CHIOU H K CHUNG H Y HSU Y C	2013	IEEE Trans Compon Packag Technol2013，35，9：	1

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