维普中文期刊产品整合服务
1篇 您的检索式:作者名="Zhanxun Che"
    题名 作者 年代 出处 被引量
1Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface显示文摘The thermal conductivity of diamond particles reinforced copper matrix composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface.The paper investigates the heat transport behavior between a 200-nm Cu layer and a single-crystalline diamond substrate inserted by a chromium(Cr)interlayer having a series of thicknesses from 150 nm down to 5 nm.The purpose is to detect the impact of the modifying interlayer thickness on the interfacial thermal conductance(h)between Cu and diamond.The time-domain thermoreflectance measurements suggest that the introduction of Cr interlayer dramatically improves the h between Cu and diamond owing to the enhanced interfacial adhesion and bridged dissimilar phonon states between Cu and diamond.The h value exhibits a decreasing trend as the Cr interlayer becomes thicker because of the increase in thermal resistance of Cr interlayer.The high h values are observed for the Cr interlayer thicknesses below 21 nm since phononic transport channel dominates the thermal conduction in the ultrathin Cr layer.The findings provide a way to tune the thermal conduction across the metal/nonmetal heterogeneous interface,which plays a pivotal role in designing materials and devices for thermal management applications.Xiaoyan Liu Fangyuan Sun Wei Wang Jie Zhao Luhua Wang Zhanxun Che Guangzhu Bai Xitao Wang Jinguo Wang Moon JKim Hailong Zhang 2022International Journal of Minerals,Metallurgy and Materials2022,29,11:0
返回顶部 每页显示:
共1页 首页 上一页 第1页 下一页 末页 /1 跳转

网站首页 | 关于我们 | 联系我们 | 产品服务 | 客服中心 | 广告服务 | 版权声明 | 网站联盟 | 友情链接 | 售卡网点

版权所有© 渝B2-20050021-1 渝公网安备 50019002500403号 违法和不良信息举报中心

互联网出版许可证 新出网证(渝)字10号 全国400电话 - 免长途话费