| 1 | A STUDY OF CONTINUOUS EXTRUSION-CLADDING PROCESSFOR PRODUCTION OF ALUMINUM-CLADDING STEEL WIRE显示文摘In this study the process of cladding steel wires with aluminum is investigated experimentally. It is studied how the cladding process and the quality of products are influenced by the aluminum deformation temperature, the wheel speed, the temperature of steel wire, the wire speed and the steel wire tensile force. The relation among the process parameters above is discussed, and the effect of the aluminum deformation temperature on the coating microstructure is analyzed. This paper suggested a reasonable range of process parameters for producing aluminum cladding steel wires. | F.Gao, B.Y.Song,C.B.Jia and Y.H.Wang Department of Material Science and Engineering, Dalian Railway Institute, Dalian 116028, China | 1999 | Acta Metallurgica Sinica(English Letters)1999，12，5： | 2 |
| 3 | Flux focusing with a superconducting nanoneedle for scanning SQUID susceptometry显示文摘A nanofabricated superconducting quantum interference device(nano-SQUID)is a direct and sensitive flux probe used for magnetic imaging of quantum materials and mesoscopic devices.Due to the functionalities of superconductive integrated circuits,nano-SQUIDs fabricated on chips are particularly versatile,but their spatial resolution has been limited by their planar geometries.Here,we use femtosecond laser 3-dimensional(3D)lithography to print a needle onto a nano-SQUID susceptometer to overcome the limits of the planar structure.The nanoneedle coated with a superconducting shell focused the flux from both the field coil and the sample.We performed scanning imaging with such a needle-on-SQUID(NoS)device on superconducting test patterns with topographic feedback.The NoS showed improved spatial resolution in both magnetometry and susceptometry relative to the planarized counterpart.This work serves as a proof-of-principle for integration and inductive coupling between superconducting 3D nanostructures and on-chip Josephson nanodevices. | B.K.Xiang S.Y.Wang Y.F.Wang J.J.Zhu H.T.Xu Y.H.Wang | 2023 | Microsystems & Nanoengineering2023，9，3： | 0 |
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