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| 1 | Review on Zinc Oxide Nanoparticles: Antibacterial Activity and Toxicity Mechanism显示文摘Antibacterial activity of zinc oxide nanoparticles(Zn O-NPs) has received significant interest worldwide particularly by the implementation of nanotechnology to synthesize particles in the nanometer region. Many microorganisms exist in the range from hundreds of nanometers to tens of micrometers. Zn O-NPs exhibit attractive antibacterial properties due to increased specific surface area as the reduced particle size leading to enhanced particle surface reactivity. Zn O is a bio-safe material that possesses photo-oxidizing and photocatalysis impacts on chemical and biological species. This review covered Zn O-NPs antibacterial activity including testing methods, impact of UV illumination, Zn O particle properties(size, concentration, morphology, and defects), particle surface modification, and minimum inhibitory concentration. Particular emphasize was given to bactericidal and bacteriostatic mechanisms with focus on generation of reactive oxygen species(ROS) including hydrogen peroxide(H2O2), OH-(hydroxyl radicals), and O2-2(peroxide). ROS has been a major factor for several mechanisms including cell wall damage due to Zn O-localized interaction, enhanced membrane permeability, internalization of NPs due to loss of proton motive force and uptake of toxic dissolved zinc ions.These have led to mitochondria weakness, intracellular outflow, and release in gene expression of oxidative stress which caused eventual cell growth inhibition and cell death. In some cases, enhanced antibacterial activity can be attributed to surface defects on Zn O abrasive surface texture. One functional application of the Zn O antibacterial bioactivity was discussed in food packaging industry where Zn O-NPs are used as an antibacterial agent toward foodborne diseases. Proper incorporation of Zn O-NPs into packaging materials can cause interaction with foodborne pathogens, thereby releasing NPs onto food surface where they come in contact with bad bacteria and cause the bacterial death and/or inhibition. | Amna Sirelkhatim Shahrom Mahmud Azman Seeni Noor Haida Mohamad Kaus Ling Chuo Ann Siti Khadijah Mohd Bakhori Habsah Hasan Dasmawati Mohamad | 2015 | Nano-Micro Letters2015，7，3： | 76 |
| 2 | Physical properties of fish gelatin-based bio-nanocomposite films incor- porated with ZnO nanorods显示文摘 | Jalal Rouhi Shahrom Mahmud Nima Naderi | 2013 | Nanoscale Research Letters2013，8，1： | 1 |
| 3 | Antimicrobial, rheological, and physicochemical properties of sago starch films filled with nanorod-rich zinc oxide显示文摘 | Abdorreza Mohammadi Nafchi Abd Karim Alias Shahrom Mahmud Marju Robal | 2012 | Journal of Food Engineering2012，，4： | 1 |
| 4 | Heat transfer enhancement in MOSFET mounted on different FR4 substrates by thermal transient measurement显示文摘Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistance are the critical parameters that determine the thermal management and reliability in electronics cooling. Metal oxide field effect transistor(MOSFET)is an important semiconductor device for light emitting diode-integrated circuit(LED IC) driver application, and thermal management in MOSFET is a major challenge. In this study, investigations on thermal performance of MOSFET are performed for evaluating the junction temperature and thermal resistance. Suitable modifications in FR4 substrates are proposed by introducing thermal vias and copper layer coating to improve the thermal performance of MOSFET. Experiments are conducted using thermal transient tester(T3ster) at 2.0 A input current and ambient temperature varying from25?C to 75?C. The thermal parameters are measured for three proposed designs: FR4 with circular thermal vias, FR4 with single strip of copper layer and embedded vias, and FR4 with I-shaped copper layer, and compared with that of plain FR4 substrate. From the experimental results, FR4_(I-shaped)shows promising results by 33.71% reduction in junction temperature and 54.19% reduction in thermal resistance. For elevated temperature, the relative increases in junction temperature and thermal resistance are lower for FR4_(I-shaped)than those for other substrates considered. The introduction of thermal vias and copper layer plays a significant role in thermal performance. | Norazlina M S Dheepan Chakravarthii M K Shanmugan S Mutharasu D Shahrom Mahmud | 2017 | Chinese Physics B2017，26，9： | 0 |
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