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您的检索式：作者名="Saurav Goel"
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| 1 | Anisotropy of single-crystal 3C-SiC during nanometric cutting 显示文摘 | Saurav Goel Alexander Stukowski | 2013 | Modelling and Simula- tion in Materials Science and Engineering2013，21，6： | 1 |
| 2 | Atomic-Scale Friction Studies on Single-Crystal Gallium Arsenide Using Atomic Force Microscope and Molecular Dynamics Simulation显示文摘This paper provides a fresh perspective and new insights into nanoscale friction by investigating it through molecular dynamics(MD)simulation and atomic force microscope(AFM)nanoscratch experiments.This work considered gallium arsenide,an importantⅢ-Ⅴdirect bandgap semiconductor material residing in the zincblende structure,as a reference sample material due to its growing usage in 5G communication devices.In the simulations,the scratch depth was tested as a variable in the fine range of 0.5-3 nm to understand the behavior of material removal and to gain insights into the nanoscale friction.Scratch force,normal force,and average cutting forces were extracted from the simulation to obtain two scalar quantities,namely,the scratch cutting energy(defined as the work performed to remove a unit volume of material)and the kinetic coefficient of friction(defined as the force ratio).A strong size effect was observed for scratch depths below 2 nm from the MD simulations and about 15 nm from the AFM experiments.A strong quantitative corroboration was obtained between the specific scratch energy determined by the MD simulations and the AFM experiments,and more qualitative corroboration was derived for the pile-up and the kinetic coefficient of friction.This conclusion suggests that the specific scratch energy is insensitive to the tool geometry and the scratch speed used in this investigation.However,the pile-up and kinetic coefficient of friction are dependent on the geometry of the tool tip. | Pengfei Fan Saurav Goel Xichun Luo Hari M.Upadhyaya | 2022 | Nanomanufacturing and Metrology2022，5，1： | 0 |
| 3 | Surface defects incorporated diamond machining of silicon显示文摘This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the surface defect machining(SDM)method.The hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating,cryogenic cooling,electric pulse or ultrasonic elliptical vibration.The SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining mode.This paper made use of Raman spectroscopy data,average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional single-point diamond turning(SPDT)and SDM while incorporating surface defects in the(i)circumferential and(ii)radial directions.Complementary 3D finite element analysis(FEA)was performed to analyse the cutting forces and the evolution of residual stress on the machined wafer.It was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness(Ra)of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting parameters.The observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all cases.FEA was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining performance.The information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard,brittle materials such as SiC,ZnSe and GaAs as well as hard steels. | Neha Khatri Borad M Barkachary B Muneeswaran Rajab Al-Sayegh Xichun Luo Saurav Goel | 2020 | International Journal of Extreme Manufacturing2020，2，4： | 0 |
| 4 | Recent progress and perspective on batteries made from nuclear waste显示文摘Sustainable energy sources are an immediate need to cope with the imminent issue of climate change the world is facing today.In particular,the long-lasting miniatured power sources that can supply energy continually to power handheld gadgets,sensors,electronic devices,unmanned airborne vehicles in space and extreme mining are some of the examples where this is an acute need.It is known from basic physics that radioactive materials decay over few years and some nuclear materials have their half-life until thousands of years.The past five decades of research have been spent harnessing the decay energy of the radioactive materials to develop batteries that can last until the radioactive reaction continues.Thus,an emergent opportunity of industrial symbiosis to make use of nuclear waste by using radioactive waste as raw material to develop bat-teries with long shelf life presents a great opportunity for sustainable energy resource development.However,the current canon of research on this topic is scarce.This perspective draws fresh discussions on the topic while highlighting future directions in this wealthy arena of research.Graphical abstract A long-lasting miniaturised nuclear battery utilising 14C radioactive isotope as fuel. | Nirmal Kumar Katiyar Saurav Goel | 2023 | Nuclear Science and Techniques2023，34，3： | 0 |
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