维普中文期刊产品整合服务
46篇 您的检索式:作者名="MAEX K"
    题名 作者 年代 出处 被引量
1Composite poly mercore silicashell abrasive particles daring oxide CMP 显示文摘Armini S Whelan C M Maex K 2007Journal of the electrochemical society2007,154,8:1
2显示文摘Shamiryan D Baklanov M R Maex K 2003J Vac Sci Technol B2003,21,:1
3Silicides for integrated circuits:TiSi2 and CoSi2显示文摘MAEX K 1993Materials Science and Engineering1993,11,23:1
4Engineering polymer core - silica size in composite abrasives for CMP applications 显示文摘S Armioi C M Whelan K Maex 2008Electrochemical and Solid - State Letters2008,11,10:1
5Low dielectric constant materials for microeleetronics显示文摘 2003J Appl Phys2003,93,:1
6Composite polymer coresilica shell abrasives: The effect of polishing time and slurry solid content on oxide CMP显示文摘ARMINI S WHELAN C M MOINPOUR M MAEX K 2007Electrochemical and Solid-State Letters2007,10,9:1
7Engineering polymer core-silica shell size in the composite abrasives for CMP applications 显示文摘Armini S Whelan C M Maex K 2008Electrochemical and solid-state letters2008,11,10:1
8Tunnel field-effect transistor without gate-drain overlap 显示文摘VERHULST A S VANDENBERGHE W G MAEX K 2007Applied Physics Letters2007,91,5:1
9Composite polymer core-silica shell abrasives: The effect of the shape of the silica particles on oxide CMP显示文摘ARMINI S WHELAN C M MOINPOUR M MAEX K 2008Journal of the Electrochemical Society2008,155,6:1
10Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions显示文摘WU W BRONGERSMA S H HOVE M V MAEX K 2004Appl Phys Lett2004,84,15:1
11Composite polymer eore-ceria shell abrasive particles during oxide CMP: A defectivity study显示文摘ARMINI S de MESSEMAEKER J WHELAN C M MOINPOUR M MAEX K 2008Journal of the Electrochemical Society2008,155,9:1
12Engineering polymer core-silica size in composite abrasives for CMP applications显示文摘ARMINI S WHELAN C M MAEX K 2008Electrochemical and Solid-State Letters2008,11,10:1
13Low dielectric constant materials for microelectronics显示文摘MAEX K BAKLANOV M R SHAMIRYAN D 2003Journal of Applied physics2003,93,11:1
14Read stability and writeability analysis of SRAM ceils for nanometer technologies显示文摘Grossar E Stucchi M Maex K 2006IEEE Journal of Solid-state Circuit2006,41,11:1
15Composite polymer core-ceria shell abrasive particles during oxide CMP: A defectivity study显示文摘ARIMIN1 S de MESSEMAEKER J WHELAN C M MOINPOUR M MAEX K 2008Journal of the Electrochemical Society2008,155,9:1
16Low dielectric constant materials for microelectronics显示文摘Maex K Baklanov M R Shamiryan D 2003Journal of Applied Physics2003,93,11:1
17Low dielectric constant materials for microelectronics 显示文摘Maex K Baklanov M R Shamiryan D 2003J Appl Phys2003,93,:1
18Composite polymer core-silica shell abrasives: The effect of polishing time and slurry solid content on oxide CMP显示文摘ARM1NI S WHELAN C M MOINPOUR M MAEX K 2007Electrochemical and Solid-State Letters2007,10,9:1
19Composite polymer core-silica shell abrasives: The effect of the shape of the silica particles on oxide CMP显示文摘ARMINI S WHELAN C M MOINPOUR M MAEX K 2008Journal of the Electrochemical Society2008,155,6:1
20Engineering polymer core-silica size in composite abrasives for CMP applications显示文摘ARMINI S WHELAN C M MAEX K 2008Electrochemical and Solid-State Letters2008,11,10:1
返回顶部 每页显示:
共3页 首页 上一页 第1页 下一页 末页 /3 跳转

网站首页 | 关于我们 | 联系我们 | 产品服务 | 客服中心 | 广告服务 | 版权声明 | 网站联盟 | 友情链接 | 售卡网点

版权所有© 渝B2-20050021-1 渝公网安备 50019002500403号 违法和不良信息举报中心

互联网出版许可证 新出网证(渝)字10号 全国400电话 - 免长途话费