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您的检索式：作者名="Hongti Zhang"
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| 1 | Diamond semiconductor and elastic strain engineering显示文摘Diamond,as an ultra-wide bandgap semiconductor,has become a promising candidate for next-generation microelec-tronics and optoelectronics due to its numerous advantages over conventional semiconductors,including ultrahigh carrier mo-bility and thermal conductivity,low thermal expansion coefficient,and ultra-high breakdown voltage,etc.Despite these ex-traordinary properties,diamond also faces various challenges before being practically used in the semiconductor industry.This review begins with a brief summary of previous efforts to model and construct diamond-based high-voltage switching diodes,high-power/high-frequency field-effect transistors,MEMS/NEMS,and devices operating at high temperatures.Following that,we will discuss recent developments to address scalable diamond device applications,emphasizing the synthesis of large-area,high-quality CVD diamond films and difficulties in diamond doping.Lastly,we show potential solutions to modulate diamond’s electronic properties by the“elastic strain engineering”strategy,which sheds light on the future development of diamond-based electronics,photonics and quantum systems. | Chaoqun Dang Anliang Lu Heyi Wang Hongti Zhang Yang Lu | 2022 | Journal of Semiconductors2022，43，2： | 2 |
| 2 | Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries显示文摘Despite being strong with many outstanding physical properties,tungsten is inherently brittle at room temperature,restricting its structural and functional applications at small scales.Here,a facile strategy has been adopted,to introduce high-density dislocations while reducing grain boundaries,through electron backscatter diffraction(EBSD)-guided microfabrication of cold-drawn bulk tungsten wires.The designed tungsten microwire attains an ultralarge uniform tensile elongation of~10.6%,while retains a high yield strength of~2.4 GPa.in situ TEM tensile testing reveals that the large uniform elongation of tungsten microwires originates from the motion of pre-existing high-density dislocations,while the subsequent ductile fracture is attributed to crack-tip plasticity and the inhibition of grain boundary cracking.This work demonstrates the application potential of tungsten microcomponents with superior ductility and workability for micro/nanoscale mechanical,electronic,and energy systems. | Chaoqun Dang Weitong Lin Fanling Meng Hongti Zhang Sufeng Fan Xiaocui Li Ke Cao Haokun Yang Wenzhao Zhou Zhengjie Fan Ji-jung Kai Yang Lu | 2021 | Journal of Materials Science & Technology2021，，36： | 0 |
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