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35篇 您的检索式：作者名="EYRAUD M"

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	题名	作者	年代	出处	被引量
1	Electrochemical Properties of Composites Based on Nanocrystalline Anatase (TiO2) and Copper Compounds (CuBr, CuO ) 显示文摘	Massiani Y Garnier A Eyraud M Knauth P	2001	Journal of Applied Electrochemistry2001，31，：	1
2	Influence of various nickel underlayers on the corrosion behaviour of AlN films deposited by reactive sputtering显示文摘	Vacandio F Massiani Y Eyraud M Rossi S Fedrizzi L	2001	Surface and Coatings Technology2001，137，：	1
3	Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements显示文摘	Bonou L Eyraud M Denoyel R	2002	Elec- trochimica Acta2002，47，：	1
4	Influence of substrate on the electrodeposition of nickel-molybdenum alloys 显示文摘	Eyraud M Arvia C	1992	J Appl Electrochem1992，22，：	1
5	Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements 显示文摘	Bonou L Eyraud M Denoyel R	2002	Electrochimica Acta2002，47，：	1
6	Tunable electrical properties of self-organized zirconia nanotubcs 显示文摘	VACANDIO F EYRAUD M KNAUTH P	2011	Electrochem Commun2011，13，：	1
7	Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements显示文摘	Bonou L Eyraud M Denoyel R	2002	Electrochimica Acta2002，47，：	1
8	Effect of additives on Cu electrodeposits: electrochemical study coupled with EQCM measurements 显示文摘	Eyraud M Kologo S Bonou L	2006	Electroceram2006，16，：	1
9	Influence of additives on Cu electrodeposition mechanisms in acid solution:direct current study supported by non-electrochemical measurements显示文摘	BONOU L EYRAUD M DENOYEL R	2002	Electrochimica Acta2002，47，26：	1
10	Effect of additives on Cu electrodeposits: electrochemical study coupled with EQCM measurements 显示文摘	Eyraud M Kologo S Bonou L	2006	Electroceram2006，16，：	1
11	Inhibitors of antibiotic efflux pump in resistant Enterobacter aerogenes strains显示文摘	Mallea M Chevalier J Eyraud A	2002	Biochem Biophys Res Cammun2002，293，5：	1
12	Robotic versus laparo-scopic partial nephrectomy; a systematic review andmeta-analysis显示文摘	Aboumarzouk O M Stein R J'Eyraud R Haber G P Chlosta P L Somani B K	2012	Eur Urol2012，62，：	1
13	Hydrogen Absorption During Zinc Plating on Steel显示文摘	Casanova T Soto F Eyraud M	1997	Corros Sei1997，39，3：	1
14	Inhibitors of antibiotic efflux pump in resistant Enterobacter aerogenes strain显示文摘	MALLEA M CHEVALIER J EYRAUD A	2002	Bio-chem Biophys Res Commun2002，293，：	1
15	Inhibitors of antibiotic efflux pump in resistant Enterobacter aerogenes strains显示文摘	Mallea M Chevalier J Eyraud A	2002	Biochem Biophys Res Commun2002，293，5：	1
16	Iniluence of addi- tives on Cu eleetrodeposition mechanisms in acid solu- tion: direct current study supported by non-electrochemi- cal measurements 显示文摘	Bon-u L Eyraud M Denoyel R	2002	Electrochimica Aeta2002，47，26：	1
17	Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study sup- ported by non-electro chemical measurements显示文摘	Bonou L Eyraud M Denoyel R	2002	Electrochim Acta2002，47，26：	1
18	Effect of additives on Cu eleetrodeposits: electrochemical study coupled with EQCM measurements显示文摘	Eyraud M Kologo S Bonou L	2006	Journal of Electroceramics2006，16，1：	1
19	Influence of substrate on the electrodeposition of nickel-molybdennum alloys显示文摘	Crousier J Eyraud M Roman J M	1992	J Appl Electrochem1992，22，8：	1
20	Oxidation of CuBr-TiO2,Electrochemical properties of composites based on nanocrystalline anatase(TiO2)and copper compounds(CuBr,CuO)显示文摘	MASSIANI Y GARNIER A EYRAUD M	2001	Journal of Applied Electrochemistry2001，31，：	1

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