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28篇 您的检索式：期刊名="IEEE Trans Compon Hybrids Manuf Technol"

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	题名	作者	年代	出处	被引量
1	Effect of oxide glass on the sintering behavior and electrical properties in Ag thick films 显示文摘	Chung Y S Kim H G	1988	IEEE Tran Compon Hybrid Manuf Technol1988，11，2：	1
2	Barrier layer multilayer ceramic capacitor processing:effects of termination and plating process parameters显示文摘	Anderson F R Haynes R Pinault S C	1989	IEEE Trans compon Hybrids Manuf Technol1989，12，4：	1
3	A model for sheet resistivity of RuO2 thick film resistors 显示文摘	Vest R W	1991	IEEE Tran Compon Hybrid Manuf Technol1991，14，2：	1
4	Correlation of silver migration with temperture-humidity-bias (THB) failures in multilayer ceramic capacitors显示文摘	Ling H C Jackson A M	1989	IEEE Trans compon Hybrids Manuf Technol1989，12，1：	1
5	Improved thermal conductivity in microelectronicencapsulates显示文摘	Procter P Sole J	1991	IEEE Trans Compon Hybrids Manuf Technol1991，14，4：	1
6	Design of low dielectric glass+ceramic for multiplayer ceramic substrate显示文摘	Jean J H Gupta T K	1994	IEEE Trans Compon Hybrids Manuf Technol B1994，17，2：	1
7	Translucent AlN ceramics substrate显示文摘	KURAMOTO N TANIGUCHI H ASO I	1987	IEEE Trans Compon Hybrids Manuf Technol1987，9，4：	1
8	Sinterable glass-ceramic for high-performance substrates显示文摘	Kumar A H Knickerbocker S Tummala R R	1992	IEEE Trans Compon Hybrids Manuf Technol1992，215，：	1
9	Constitutive relations for tin-based solder joints显示文摘	Darveaux R Banerji K	1992	IEEE Trans Compon Hybrids Manuf Technol1992，15，6：	1
10	Improved thermal conductivity in microelectronic encapsulants显示文摘	Procter P Solc J	1991	IEEE Trans Compon Hybrids Manuf Technol1991，14，4：	1
11	Morphology and adhesion strength in electroless Cu metallized AIN substrate 显示文摘	Chang J H Duh J G Chiou B S	1993	IEEE Trans Compon Hybrids Manuf Technol1993，16，8：	1
12	Large scale multilayer glass ceramic substrate for supercomputer 显示文摘	SHIMADA Y KOBAYASHI Y KATA K	1990	IEEE Trans Compon Hybrids Manuf Technol1990，13，4：	1
13	A bonding technique for thin GaAs dice with via holes using gold-tin composites 显示文摘	WANG C Y LEE C C	1991	IEEE Trans on Compon Hybrids Manuf Technol1991，14，4：	1
14	A fracture mechanism approach to thermal fatigue life prediction of solder joints显示文摘	BONDNER S R PAO Y H	1992	IEEE Trans Compon Hybrids Manuf Technol1992，15，4：	1
15	Improved Thermal Conductivity in Microelectronic Encapsulates显示文摘	Procter P Solc J	1991	IEEE Trans Compon Hybrids Manuf Technol1991，14，4：	1
16	Traslucent AIN ceramics substrate显示文摘	NOBUYUKI Kuramoto HITOFUMI Taniguchi ISAO Aso	1987	IEEE Trans Compon Hybrids Manuf Technol1987，9，4：	1
17	Thermomechanical fatigue of solder joints:A new comprehensive test method显示文摘	Darrel R F	1989	IEEE Trans Compon Hybrids Manuf Technol1989，12，4：	1
18	The effect of dust contamination on electric contacts 显示文摘	Zhang J G Wen X M	1986	IEEE Trans on Compon Hybrids Manuf Technol1986，9，1：	1
19	High thermal conductivity aluminum nitride ceramic substrates and packages显示文摘	IWASE N TSUGE A	1990	IEEE Trans Compon Hybrids Manuf Technol1990，13，2：	1
20	The effect of dust contamination on electric contacts 显示文摘	Zhang J G WenXM	1986	IEEE Trans on Compon Hybrids Manuf Technol1986，9，1：	1

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