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236篇 您的检索式：期刊名="Electronics Packaging Manufacturing"

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	题名	作者	年代	出处	被引量
1	Drop on Demand Solder Droplet Jetting System for Fabricating Microstructure显示文摘	LEE T M KANG T G YANG J S	2008	Electronics Packaging Manufacturing2008，31，3：	1
2	Printed circuit board recycling: A state-of-the-art survey显示文摘	JIANGZHI L SHRIVASTAVA P ZONG G	2004	Electronics Packaging Manufacturing IEEE Transactions2004，27，1：	1
3	ESD Phenomena in GMR Heads in the Manufacturing Process of HDD and GMR Heads显示文摘	Matsugi Junya Mizoh Yoshiaki Nakano Taro	2005	IEEE Transaction on Electronics Packaging Manufacturing2005，28，3：	1
4	Rough Set Theory:a Data Mining Tool for Semiconductor Manufacturing显示文摘	Andrew Kusiak	2001	IEEE Transactions on Electronics Packaging Manufacturing2001，24，1：	1
5	A new bumping process using the lead- free solder paste 显示文摘	SUGA T SAITO K	2002	IEEE Transactions on Electronics Packaging Manufacturing2002，25，4：	1
6	Evaluation and optimization of package processing and design through solder joint profile prediction显示文摘	Yeung B H Lee T Y T	2003	Electronic Packaging Manufacturing2003，26，1：	1
7	Comprehensive treatment of moisture induced failure in IC packaging 显示文摘	WONG E H KOH S W LEE K H	2002	IEEE Transactions on Electronics Packaging Manufacturing2002，25，3：	1
8	The changing automotive environment: high-temperature electronics 显示文摘	Johnson R W Evans J L Jacobsen Peter	2004	IEEE transactions on electronics packaging manufacturing2004，27，3：	1
9	Grant viable plastics recycling from end-of-life electronics显示文摘	Qu Xiuli Ann Julie Williams S	2006	IEEE Transactions on Electronics Packaging Manufacturing2006，29，1：	1
10	Optimizing disassembly and recycling processfor eol lcd-type products:a heuristic method显示文摘	SHIH L H LEE S C	2007	IEEE TransactionsOn Electronics Packaging Manufacturing2007，30，3：	1
11	Solder joints inspe(~tion using a neural network and fuzzy rule-based classification method显示文摘	Ko K W Cho H S	2000	IEEE Transactions on Electronics Packaging Manufacturing2000，23，2：	1
12	The effect of annealing on tin whisker growth显示文摘	FUKUDA Y OSTERMAN M PECHT M	2006	IEEE Transactions on Electronics Packaging Manufacturing2006，29，4：	1
13	Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives 显示文摘	Lilei Y Zonghe L Johan L	1999	Electronics Packaging Manufacturing IEEE Transactions on1999，22，4：	1
14	Optimal design for a ball grid array wire bonding process using a neuro-genetic approach 显示文摘	SU C T CHIANG T L	2002	IEEE Trans on Electronics Packaging Manufacturing2002，25，1：	1
15	Micropositioning of a weakly calibrated microassembly system using coarse-to-fine visual servoing strategies显示文摘	Vikramaditya B Nelson B J	2000	IEEE Transactions On Electronics Packaging Manufacturing2000，23，2：	1
16	Length distribution analysis for tin whisker growth显示文摘	FUKUDA Y OSTERMAN M PECHT M	2007	IEEE Transactions on Electronics Packaging Manufacturing2007，30，1：	1
17	Off-line control time-pressure dispensing process for electronics packaging显示文摘	Chen X B Zhang W J Shoenau G	2003	IEEE Transactions on Electronics Packaging Manufacturing2003，26，4：	1
18	Conductivity mechanisms of isotropic conductive adhesives (ICAs)显示文摘	Lu D Tong Q K Wong C P	1999	IEEE Transactions on Electronics Packaging Manufacturing1999，22，3：	1
19	Solder joint reliability in electronics under shock and vibration using explicit finiteelement submodeling 显示文摘	Pradeep L Sameep G Prakriti C	2007	IEEE transactions on electronics packaging manufacturing2007，30，1：	1
20	A Neural-Network Approach for Defect Recognition in TFT-LCD Photolithography Process 显示文摘	CHEN Li-fei SU Chao-tong CHEN Meng-heng	2009	IEEE Transactions on Electronics Packaging Manufacturing(S1521-334X)2009，32，1：	1

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