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Investigation of surface morphology and ion activation of aluminium implanted 4H-SiC

查看全文 作  者:SONG [1]QingWen;ZHANG [1]YuMing;ZHANG [1]YiMen;TANG [1]XiaoYan 高影响力作者 机构地区:[1]Key Luboratory of Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics,Xidiau University,Xi'an 710071,China高影响力机构 出  处:《Science China(Technological Sciences)》索引2012年第55卷第12期,共4页高影响力期刊 基  金:supported by the National Natural Science Foundation of China (Grant Nos. 61006060, 61176070) 摘  要:Multiple-energy aluminium (Al+ ) implantation into 4H-SiC (0001) epilayer and activation anneal with a graphite encapsulation layer were investigated in this paper. Measurements showed that the implanted Al+ box doping profile was formed and a high ion activation ratio of 78% was achieved by 40 min annealing at 1600°C using a horizontal chemical vapor deposition (CVD) reactor. The step bunching effect associated with the high temperature post implantation activation annealing (PIA) process was dramatically suppressed by using the graphite encapsulation layer. And a flat and smooth surface with a small average surface roughness (RMS) value of around 1.16 nm was achieved for the implanted 4H-SiC after the PIA process. It was demonstrated that this surface protection technique is a quite effective process for 4H-SiC power devices fabrication. 关 键 词:4H-SIC 离子激活 表面形貌 植入 化学气相沉积 表面保护技术 表面粗糙度
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